Job details
Job type full-time number of hires for this role 1
Qualifications
Bachelor`s (preferred)
Semiconductor packaging/assembly industry: 10 years (preferred)
Full job description
Description:
Packaging application engineering manager is to provide current and potential customers with technical support regarding products, applications, and issues, servicing and qualifying both new product introductions and existing showa denko’s advanced packaging materials through deep experience and knowledge in semiconductor assembly and process materialsCandidate requires excellent critical thinking, communication and interpersonal skills.
Primary job functions:
1Provide comprehensive technical and quality support for new and existing customers in the packaging materials i.eEpoxy molding compound, die bonding materials, thermal interface materials, and various other materials both commercial and developmental gradesThis will include but not limited to:
· promote or introduce new product leading to qualification on current or future customer products
· on-site technical support on need-to basis
· respond to customer’s quality issues
· problem solving with collaboration with corporate r&d
· build and maintain excellent relationship with customers to advance opportunities for new business potential
Above will be executed in conjunction with a sales representative.
2Closely gather and analyze market/industry trends and technology roadmaps and feed relevant information to corporate r&d.
3Working with corporate r&d and marketing team, devise r&d strategies that will enable growth of company’s global packaging materials business.
4Build and sustain network with key industry personnel (idm’s, foundries, equipment vendors, osats, etc.)
5Attend technical conferences and trade shows to present technical papers to promote company’s products and services.
6Assess technologies of other companies (start-ups, competitors, and partners) and make recommendations when it is a good fit for sdm’s technology portfolio.
7Provide technical support to venture new applications or new product development opportunities with both customers and hq r&d.
Experience:
10+ years of experience working within semiconductor packaging/assembly industry experience are required.
Must have a deep technical knowledge of advanced packaging technologies such as in surface mount technology and leading-edge trends in wafer level packaging and convergence of wafer processing and assembly.
Demonstrate an understanding of the interface between materials and the packages.
Active role or participation in technical association, standards or related trade conferences is a plus.
Travel: the position requires 30-40% travel.
Job type: full-time
Benefits:
401(k)
401(k) matching
Dental insurance
Flexible spending account
Health insurance
Health savings account
Life insurance
Paid time off
Referral program
Retirement plan
Vision insurance
Schedule:
Monday to friday
Education:
Bachelor`s (preferred)
Experience:
Semiconductor packaging/assembly industry: 10 years (preferred)
Work location:
Fully remote
Work location: remote
